Apple MacBook Air (Original Envelope Launch)

Technical Architecture Summary

CPU Family: Intel Core 2 Duo
Max Graphics TGP: 15W TGP
RAM Upgradability: Soldered Onboard
Battery / Weight: 37 Wh / 1.36 kg

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Comprehensive Hardware Specification Matrix

Direct engineering breakdown categorized by compute, display, thermal envelope, I/O, and chassis acoustics.

01.Platform & Compute Architecture

Processor / SoC: Intel Core 2 Duo (Merom 65nm, 4MB L2 cache)
CPU Core Configuration: 2-core / 2-thread (1.6 GHz or 1.8 GHz)
Instruction Set: x86_64
Graphics Subsystem: Intel Graphics Media Accelerator GMA X3100 (144MB shared)
Max Graphics TGP: 15 Watts
Operating System: Mac OS X 10.5 Leopard

02.Memory & Storage Upgradability

RAM Capacity Options: 2 GB (Soldered onboard)
RAM Technology / Clock: DDR2-667 MHz SDRAM
Memory Upgradability: No (Soldered Onboard)
Memory Sockets / Form Factor: Soldered Onboard (Non-upgradable)
Base NVMe Capacity: 80 GB
M.2 Expansion Slots: 0 Slots
Storage Bus & Type: 1.8-inch Parallel ATA (ZIF connector drive bay)

03.Display & Color Accuracy

Display Panel Technology: TFT LCD
Screen Diagonal Size: 13.3 inches
Aspect Ratio: 16:10
Native Resolution: 1280 × 800 px (113 ppi)
Refresh Rate: 60 Hz
Color Gamut Calibration: 65% sRGB
Peak Brightness: 300 nits

04.Chassis, Thermals & Battery

Weight: 1.36 kg (3 lbs)
Thickness: 19.3 mm
Chassis Materials: Precision CNC-machined aluminum unibody enclosure
Thermal Architecture: Single ultra-slim centrifugal blower with copper heatpipe
Battery Capacity: 37 Watt-hours
Bundled Adapter Wattage: 45 W
USB-C Power Delivery Input: Proprietary AC Adapter Only