Samsung Galaxy Z Flip6
Full factory technical datasheet and laboratory hardware reference for the Samsung Galaxy Z Flip6, featuring the Qualcomm Snapdragon 8 Gen 3 for Galaxy (4nm TSMC), a 6.7" Foldable Dynamic AMOLED 2X (6.7" Main, 1–120Hz) + 3.4" Super AMOLED FlexWindow (60Hz) panel, and a 50MP optical camera system.
Hardware Engineering Overview: Samsung Galaxy Z Flip6
The Samsung Galaxy Z Flip6 is a high-performance mobile computing device engineered around the Qualcomm Snapdragon 8 Gen 3 for Galaxy (4nm TSMC) (8-core (1x3.39 GHz + 5x3.1 GHz + 2x2.2 GHz), Adreno 750). It features a 6.7" Foldable Dynamic AMOLED 2X (6.7" Main, 1–120Hz) + 3.4" Super AMOLED FlexWindow (60Hz) at 2640 × 1080 px (Main) / 720 × 748 px (Cover) with 120Hz refresh rate and up to 2600 nits peak brightness. Optics include a 50 MP 1/1.57" (Dual Pixel PDAF, OIS) primary sensor with hardware OIS paired with 2x In-Sensor Crop zoom, powered by a 4000 mAh battery with 25W wired fast charging.
- Compute & Processing Architecture
- Qualcomm Snapdragon 8 Gen 3 for Galaxy (4nm TSMC) equipped with 8-core (1x3.39 GHz + 5x3.1 GHz + 2x2.2 GHz) and Adreno 750. Runs Android 14 (One UI 6.1.1) with Side-mounted capacitive fingerprint sensor.
- Display & Luminescence Benchmarks
- 6.7" Foldable Dynamic AMOLED 2X (6.7" Main, 1–120Hz) + 3.4" Super AMOLED FlexWindow (60Hz) panel delivering 2640 × 1080 px (Main) / 720 × 748 px (Cover) (22:9) at 120Hz and 2600 nits peak luminance.
- Optics & Cinema Video Recording
- 50 MP 1/1.57" (Dual Pixel PDAF, OIS) sensor (f/1.8) with 2x In-Sensor Crop. Video capture: 4K at 60 fps, Auto Zoom Camcorder mode.
- Battery, Power & Build Metallurgy
- 4000 mAh battery with 25W wired fast charging. Chassis: Armor Aluminum frame, Gorilla Glass Victus 2, Vapor Chamber cooling with IP48.
Complete Factory Specification Matrix
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Platform & Compute Architecture
System-on-Chip node fabrication, CPU core topology, and neural compute acceleration
Display & Visual Engineering
Panel luminescence, adaptive refresh dynamics, color bit depth, and glass protection
Camera Array & Computational Optics
Sensor format, physical aperture, optical stabilization, and cinema video pipeline
Battery & Power Dynamics
Cell chemical capacity, wired power delivery protocol, and wireless charging
Chassis, Structural Build & Durability
Frame metallurgy, structural ingress protection, and physical dimensions
Connectivity, Ports & Operating System
Launch firmware version, physical I/O connectors, cellular generations, and biometrics
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