
LG G3 (D855)
Full factory technical datasheet and laboratory hardware reference for the LG G3 (D855), featuring the Qualcomm Snapdragon 801 MSM8974AC (28nm), a 5.5" True HD-IPS LCD (First global major Quad HD display, 76.4% screen-to-body ratio) panel, and a 13MP optical camera system.
Hardware Engineering Overview: LG G3 (D855)
The LG G3 (D855) is a high-performance mobile computing device engineered around the Qualcomm Snapdragon 801 MSM8974AC (28nm) (4-core 2.5 GHz Krait 400, Adreno 330). It features a 5.5" True HD-IPS LCD (First global major Quad HD display, 76.4% screen-to-body ratio) at 2560 × 1440 px (538 ppi Quad HD) with 60Hz refresh rate and up to 450 nits peak brightness. Optics include a 13 MP 1/3.06" Sony IMX135 (OIS+, Infrared Laser Auto Focus 0.276s) primary sensor with hardware OIS paired with 1x zoom, powered by a 3000 mAh battery with 9W wired fast charging.
- Compute & Processing Architecture
- Qualcomm Snapdragon 801 MSM8974AC (28nm) equipped with 4-core 2.5 GHz Krait 400 and Adreno 330. Runs Android 4.4.2 KitKat with Knock Code.
- Display & Luminescence Benchmarks
- 5.5" True HD-IPS LCD (First global major Quad HD display, 76.4% screen-to-body ratio) panel delivering 2560 × 1440 px (538 ppi Quad HD) (16:9) at 60Hz and 450 nits peak luminance.
- Optics & Cinema Video Recording
- 13 MP 1/3.06" Sony IMX135 (OIS+, Infrared Laser Auto Focus 0.276s) sensor (f/2.4) with 1x. Video capture: 4K UHD at 30 fps, 1080p at 60 fps, 1W booster speaker.
- Battery, Power & Build Metallurgy
- 3000 mAh battery with 9W wired fast charging. Chassis: Metallic-look brushed polycarbonate back (removable), floating arc rear ergonomics with None.
Complete Factory Specification Matrix
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Platform & Compute Architecture
System-on-Chip node fabrication, CPU core topology, and neural compute acceleration
Display & Visual Engineering
Panel luminescence, adaptive refresh dynamics, color bit depth, and glass protection
Camera Array & Computational Optics
Sensor format, physical aperture, optical stabilization, and cinema video pipeline
Battery & Power Dynamics
Cell chemical capacity, wired power delivery protocol, and wireless charging
Chassis, Structural Build & Durability
Frame metallurgy, structural ingress protection, and physical dimensions
Connectivity, Ports & Operating System
Launch firmware version, physical I/O connectors, cellular generations, and biometrics
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