Google Pixel
Full factory technical datasheet and laboratory hardware reference for the Google Pixel, featuring the Qualcomm Snapdragon 821 (14nm), a 5" AMOLED (100% DCI-P3, Gorilla Glass 4) panel, and a 12.3MP optical camera system.
Hardware Engineering Overview: Google Pixel
The Google Pixel is a high-performance mobile computing device engineered around the Qualcomm Snapdragon 821 (14nm) (4-core (2x2.15 GHz Kryo + 2x1.6 GHz Kryo), Adreno 530). It features a 5" AMOLED (100% DCI-P3, Gorilla Glass 4) at 1920 × 1080 px (441 ppi Full HD) with 60Hz refresh rate and up to 450 nits peak brightness. Optics include a 12.3 MP 1/2.3" Sony IMX378 (1.55µm pixels, PDAF + Laser AF) primary sensor with electronic stabilization paired with 1x (HDR+ Zero Shutter Lag) zoom, powered by a 2770 mAh battery with 18W wired fast charging.
- Compute & Processing Architecture
- Qualcomm Snapdragon 821 (14nm) equipped with 4-core (2x2.15 GHz Kryo + 2x1.6 GHz Kryo) and Adreno 530. Runs Android 7.1 Nougat (Google Assistant launch) with Pixel Imprint rear fingerprint sensor.
- Display & Luminescence Benchmarks
- 5" AMOLED (100% DCI-P3, Gorilla Glass 4) panel delivering 1920 × 1080 px (441 ppi Full HD) (16:9) at 60Hz and 450 nits peak luminance.
- Optics & Cinema Video Recording
- 12.3 MP 1/2.3" Sony IMX378 (1.55µm pixels, PDAF + Laser AF) sensor (f/2.0) with 1x (HDR+ Zero Shutter Lag). Video capture: 4K at 30 fps with gyro-based electronic EIS stabilization.
- Battery, Power & Build Metallurgy
- 2770 mAh battery with 18W wired fast charging. Chassis: Aerospace-grade aluminum chassis with signature split-tone glass rear shade with IP53 (splash and dust protection).
Complete Factory Specification Matrix
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Platform & Compute Architecture
System-on-Chip node fabrication, CPU core topology, and neural compute acceleration
Display & Visual Engineering
Panel luminescence, adaptive refresh dynamics, color bit depth, and glass protection
Camera Array & Computational Optics
Sensor format, physical aperture, optical stabilization, and cinema video pipeline
Battery & Power Dynamics
Cell chemical capacity, wired power delivery protocol, and wireless charging
Chassis, Structural Build & Durability
Frame metallurgy, structural ingress protection, and physical dimensions
Connectivity, Ports & Operating System
Launch firmware version, physical I/O connectors, cellular generations, and biometrics
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