Apple iPhone 18
Full factory technical datasheet and laboratory hardware reference for the Apple iPhone 18, featuring the Apple A20 (TSMC 2nm N2P process, Next-Gen Neural Engine, Apple Intelligence 3.0), a 6.3" Super Retina XDR LTPO OLED (1–120Hz ProMotion, Under-Display TrueDepth Array) panel, and a 48MP optical camera system.
Hardware Engineering Overview: Apple iPhone 18
The Apple iPhone 18 is a high-performance mobile computing device engineered around the Apple A20 (TSMC 2nm N2P process, Next-Gen Neural Engine, Apple Intelligence 3.0) (6-core (2x performance + 4x efficiency), Apple-designed 5-core GPU with Neural Ray Tracing). It features a 6.3" Super Retina XDR LTPO OLED (1–120Hz ProMotion, Under-Display TrueDepth Array) at 2622 × 1206 px (460 ppi) with 120Hz refresh rate and up to 2800 nits peak brightness. Optics include a 48 MP 1/1.56" 48MP Dual-Layer Transistor CMOS (Sensor-shift OIS) primary sensor with hardware OIS paired with 2x In-Sensor Optical Quality Telephoto Crop zoom, powered by a 3700 mAh battery with 30W wired fast charging.
- Compute & Processing Architecture
- Apple A20 (TSMC 2nm N2P process, Next-Gen Neural Engine, Apple Intelligence 3.0) equipped with 6-core (2x performance + 4x efficiency) and Apple-designed 5-core GPU with Neural Ray Tracing. Runs iOS 20 with Under-Display Face ID.
- Display & Luminescence Benchmarks
- 6.3" Super Retina XDR LTPO OLED (1–120Hz ProMotion, Under-Display TrueDepth Array) panel delivering 2622 × 1206 px (460 ppi) (19.5:9) at 120Hz and 2800 nits peak luminance.
- Optics & Cinema Video Recording
- 48 MP 1/1.56" 48MP Dual-Layer Transistor CMOS (Sensor-shift OIS) sensor (f/1.6) with 2x In-Sensor Optical Quality Telephoto Crop. Video capture: 4K at 60 fps Dolby Vision HDR, Spatial Audio & Video.
- Battery, Power & Build Metallurgy
- 3700 mAh battery with 30W wired fast charging. Chassis: Aerospace aluminum chassis, Ceramic Shield 3rd Gen, Camera Control sensor with IP68 (6m up to 30 mins).
Complete Factory Specification Matrix
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Platform & Compute Architecture
System-on-Chip node fabrication, CPU core topology, and neural compute acceleration
Display & Visual Engineering
Panel luminescence, adaptive refresh dynamics, color bit depth, and glass protection
Camera Array & Computational Optics
Sensor format, physical aperture, optical stabilization, and cinema video pipeline
Battery & Power Dynamics
Cell chemical capacity, wired power delivery protocol, and wireless charging
Chassis, Structural Build & Durability
Frame metallurgy, structural ingress protection, and physical dimensions
Connectivity, Ports & Operating System
Launch firmware version, physical I/O connectors, cellular generations, and biometrics
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