
HTC One (M7)
Full factory technical datasheet and laboratory hardware reference for the HTC One (M7), featuring the Qualcomm Snapdragon 600 APQ8064T (28nm), a 4.7" Super LCD3 (World's sharpest display at launch: 469 ppi) panel, and a 4MP optical camera system.
Hardware Engineering Overview: HTC One (M7)
The HTC One (M7) is a high-performance mobile computing device engineered around the Qualcomm Snapdragon 600 APQ8064T (28nm) (4-core 1.7 GHz Krait 300, Adreno 320). It features a 4.7" Super LCD3 (World's sharpest display at launch: 469 ppi) at 1920 × 1080 px (469 ppi Full HD) with 60Hz refresh rate and up to 500 nits peak brightness. Optics include a 4 MP 1/3.0" HTC UltraPixel (2.0µm massive pixel pitch, OIS, ImageChip 2) primary sensor with hardware OIS paired with 1x zoom, powered by a 2300 mAh battery with 10W wired fast charging.
- Compute & Processing Architecture
- Qualcomm Snapdragon 600 APQ8064T (28nm) equipped with 4-core 1.7 GHz Krait 300 and Adreno 320. Runs Android 4.1.2 Jelly Bean (Sense 5, BlinkFeed) with PIN / Pattern.
- Display & Luminescence Benchmarks
- 4.7" Super LCD3 (World's sharpest display at launch: 469 ppi) panel delivering 1920 × 1080 px (469 ppi Full HD) (16:9) at 60Hz and 500 nits peak luminance.
- Optics & Cinema Video Recording
- 4 MP 1/3.0" HTC UltraPixel (2.0µm massive pixel pitch, OIS, ImageChip 2) sensor (f/2.0) with 1x. Video capture: 1080p at 30 fps with HDR video, HTC Zoe living photos.
- Battery, Power & Build Metallurgy
- 2300 mAh battery with 10W wired fast charging. Chassis: Zero-gap precision-milled aluminum unibody, HTC BoomSound dual front-facing stereo speakers with dedicated amplifiers with None.
Complete Factory Specification Matrix
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Platform & Compute Architecture
System-on-Chip node fabrication, CPU core topology, and neural compute acceleration
Display & Visual Engineering
Panel luminescence, adaptive refresh dynamics, color bit depth, and glass protection
Camera Array & Computational Optics
Sensor format, physical aperture, optical stabilization, and cinema video pipeline
Battery & Power Dynamics
Cell chemical capacity, wired power delivery protocol, and wireless charging
Chassis, Structural Build & Durability
Frame metallurgy, structural ingress protection, and physical dimensions
Connectivity, Ports & Operating System
Launch firmware version, physical I/O connectors, cellular generations, and biometrics
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