HTC Dream / T-Mobile G1
Full factory technical datasheet and laboratory hardware reference for the HTC Dream / T-Mobile G1, featuring the Qualcomm MSM7201A (65nm), a 3.2" TFT Capacitive Touchscreen (World's first commercial Android device) panel, and a 3.15MP optical camera system.
Hardware Engineering Overview: HTC Dream / T-Mobile G1
The HTC Dream / T-Mobile G1 is a high-performance mobile computing device engineered around the Qualcomm MSM7201A (65nm) (1-core 528 MHz ARM11, Adreno 130). It features a 3.2" TFT Capacitive Touchscreen (World's first commercial Android device) at 320 × 480 px (180 ppi HVGA) with 60Hz refresh rate and up to 300 nits peak brightness. Optics include a 3.15 MP 1/4.0" (Autofocus) primary sensor with electronic stabilization paired with 1x zoom, powered by a 1150 mAh battery with 5W wired fast charging.
- Compute & Processing Architecture
- Qualcomm MSM7201A (65nm) equipped with 1-core 528 MHz ARM11 and Adreno 130. Runs Android 1.0 (First commercial Android release) with PIN / Pattern.
- Display & Luminescence Benchmarks
- 3.2" TFT Capacitive Touchscreen (World's first commercial Android device) panel delivering 320 × 480 px (180 ppi HVGA) (3:2) at 60Hz and 300 nits peak luminance.
- Optics & Cinema Video Recording
- 3.15 MP 1/4.0" (Autofocus) sensor (f/2.8) with 1x. Video capture: No video recording at launch (added in Cupcake update).
- Battery, Power & Build Metallurgy
- 1150 mAh battery with 5W wired fast charging. Chassis: Sliding display mechanism revealing 5-row hardware QWERTY keyboard, trackball navigation with None.
Complete Factory Specification Matrix
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Platform & Compute Architecture
System-on-Chip node fabrication, CPU core topology, and neural compute acceleration
Display & Visual Engineering
Panel luminescence, adaptive refresh dynamics, color bit depth, and glass protection
Camera Array & Computational Optics
Sensor format, physical aperture, optical stabilization, and cinema video pipeline
Battery & Power Dynamics
Cell chemical capacity, wired power delivery protocol, and wireless charging
Chassis, Structural Build & Durability
Frame metallurgy, structural ingress protection, and physical dimensions
Connectivity, Ports & Operating System
Launch firmware version, physical I/O connectors, cellular generations, and biometrics
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