Samsung Galaxy S24 FE
Full factory technical datasheet and laboratory hardware reference for the Samsung Galaxy S24 FE, featuring the Samsung Exynos 2400e (4nm), a 6.7" Dynamic AMOLED 2X panel, and a 50MP optical camera system.
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Hardware Engineering Overview: Samsung Galaxy S24 FE
The Samsung Galaxy S24 FE is a high-performance mobile computing device engineered around the Samsung Exynos 2400e (4nm) (10-core CPU (1 Cortex-X4 + 2 Cortex-A720 + 3 Cortex-A720 + 4 Cortex-A520), Samsung Xclipse 940 (AMD RDNA 3)). It features a 6.7" Dynamic AMOLED 2X at 2340 × 1080 px (385 ppi) with 120Hz refresh rate and up to 1900 nits peak brightness. Optics include a 50 MP 1/1.57" primary sensor with hardware OIS paired with 3x Optical Zoom (75mm) zoom, powered by a 4700 mAh battery with 25W wired fast charging.
- Compute & Processing Architecture
- Samsung Exynos 2400e (4nm) equipped with 10-core CPU (1 Cortex-X4 + 2 Cortex-A720 + 3 Cortex-A720 + 4 Cortex-A520) and Samsung Xclipse 940 (AMD RDNA 3). Runs One UI 6.1 (Android 14 with Galaxy AI) with Under-Display Optical Fingerprint Sensor.
- Display & Luminescence Benchmarks
- 6.7" Dynamic AMOLED 2X panel delivering 2340 × 1080 px (385 ppi) (19.5:9) at 120Hz and 1900 nits peak luminance.
- Optics & Cinema Video Recording
- 50 MP 1/1.57" sensor (f/1.8) with 3x Optical Zoom (75mm). Video capture: 8K at 30 fps, 4K at 60 fps.
- Battery, Power & Build Metallurgy
- 4700 mAh battery with 25W wired fast charging. Chassis: Armor Aluminum frame, Gorilla Glass Victus+ front and back with IP68 (1.5 meters up to 30 mins).
Complete Factory Specification Matrix
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Platform & Compute Architecture
System-on-Chip node fabrication, CPU core topology, and neural compute acceleration
Display & Visual Engineering
Panel luminescence, adaptive refresh dynamics, color bit depth, and glass protection
Camera Array & Computational Optics
Sensor format, physical aperture, optical stabilization, and cinema video pipeline
Battery & Power Dynamics
Cell chemical capacity, wired power delivery protocol, and wireless charging
Chassis, Structural Build & Durability
Frame metallurgy, structural ingress protection, and physical dimensions
Connectivity, Ports & Operating System
Launch firmware version, physical I/O connectors, cellular generations, and biometrics
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