Framework Laptop 16 (2026 Next-Gen Workstation)

Technical Architecture Summary

CPU Family: AMD Ryzen AI Max+ 395
Max Graphics TGP: 120W TGP
RAM Upgradability: ✅ Upgradable
Battery / Weight: 90 Wh / 2.15 kg

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Comprehensive Hardware Specification Matrix

Direct engineering breakdown categorized by compute, display, thermal envelope, I/O, and chassis acoustics.

01.Platform & Compute Architecture

Processor / SoC: AMD Ryzen AI Max+ 395 (Strix Halo 16-Core Zen 5)
CPU Core Configuration: 16-core / 32-thread (Zen 5 architecture up to 5.2 GHz)
Instruction Set: x86_64
Graphics Subsystem: AMD Radeon 8060S (40 Compute Units RDNA 3.5, unified memory architecture)
Max Graphics TGP: 120 Watts
AI NPU Acceleration: 50 TOPS
Operating System: Windows 11 Pro / Ubuntu Linux / Fedora

02.Memory & Storage Upgradability

RAM Capacity Options: 32 GB, 64 GB, or 128 GB LPDDR5X (Upgradable LPCAMM2)
RAM Technology / Clock: LPCAMM2-8533 MHz user-replaceable memory module
Memory Upgradability: Yes (User-Upgradable)
Memory Sockets / Form Factor: 1x LPCAMM2 socket (100% user-replaceable next-generation memory standard)
Base NVMe Capacity: 1000 GB
M.2 Expansion Slots: 2 Slots
Storage Bus & Type: Dual M.2 2280 PCIe 5.0 x4 slots with captive fasteners

03.Display & Color Accuracy

Display Panel Technology: OLED
Screen Diagonal Size: 16 inches
Aspect Ratio: 16:10
Native Resolution: 2880 × 1800 px (3K 120Hz OLED, 0.2ms, VESA DisplayHDR True Black 600)
Refresh Rate: 120 Hz
Color Gamut Calibration: 100% DCI-P3 wide color gamut
Peak Brightness: 600 nits

04.Chassis, Thermals & Battery

Weight: 2.15 kg (4.7 lbs)
Thickness: 18.2 mm
Chassis Materials: 100% recycled aluminum chassis with modular input deck (hot-swappable keyboard and numpad modules)
Thermal Architecture: Dual 80mm modular blowers with liquid metal thermal interface and copper vapor chamber
Battery Capacity: 90 Watt-hours
Bundled Adapter Wattage: 240 W
USB-C Power Delivery Input: Yes